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Research & Innovation

Research & Innovation

Behind the quality of each of Koppers products is a world-class research and technical support team which develops and tests innovative applications and solutions for customers' existing and future business challenges.

The Koppers Global Technology Center, an applied research facility located 15 miles north of Koppers global headquarters in Pittsburgh, Pennsylvania, gives our expert team the benefits of a laboratory environment to support Koppers global operations and customers with comprehensive analytical testing services, the development of new products, and technical assistance.

Carbon Testing

Koppers provides added value and world-class technical assistance to our carbon pitch customers.

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Technical Support

Technical support is provided to analyze product performance and to develop new pitch products.

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Koppers White Papers

The Koppers team has published numerous technical papers that document our years of experience in carbon products technology.

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Koppers Patents

Koppers Patents

In compliance with 35 U.S.C. Section 287, the following information is provided.  The purchase of products covered by any of these patents or unpatented products does not include a license to any of the other patents identified herein, unless the customer receives written authorization by KOPPERS. 


Koppers Product Name

Patent/App. No.


Bonded Insulated Joint

U.S. Patent No. 5,503,331,  7,090,143,  7,490,781,  8,123,144

   Bonded Joint

Poly Gage Plate and Switch Rod Insulator

U.S. Patent No. 6,170,756,  6,305,614,  6,422,479

   Gage Plate

High Flanged Clearance Profile Bar

U.S. Patent No. D497,326,  7,097,112

   High Flg Clr Bar

Insulated Tie Plate

U.S. Patent No. 7,261,244,  8,042,747

   Insulated Plate

Long Angle Bonded Insulated Joint

U.S. Patent No. 7,975,933,  8,113,441,  8,302,878

   LAP Jt

Bonded Joint Insulator

U.S. Patent No. D547,642

  Bonded Jt Ins

CENTER LINER® Bonded Insulated Joint

U.S. Patent No. D576,023


Short Angle Bonded Insulated Joint

U.S. Patent No. 9,328,464 B2

 SAP Jt.

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